See architectural layers;
reference model
LCAS (Link Capacity Adjustment
Scheme), relationship to circuit
bonding, 270
LDP (Label Distribution Protocol)
LSRs (Label Switched Routers),
discovery of, 425
LDP signaling, rules for, 445??“446
LDP VPLS, design of, 444
LEDs (light-emitting diodes), use in
optical wireless mesh
networks, 237
legacy services, Ethernet as
substitute for, 41
light-emitting diodes (LEDs), use
in optical wireless mesh
networks, 237
line-of-sight (LOS) technology,
optical wireless mesh networks
as, 250, 255
Link Access Protocol for SONET
(LAPS), development by
ITU-T, 305
Link Capacity Adjustment Scheme
(LCAS), relationship to circuit
bonding, 270
link faults, detecting in Ethernet
networks, 169??“170
link margin of FSO systems, impact
of atmospheric effects on, 243
link monitoring, relationship to
EFM OAM, 91
link trace messages, troubleshooting
Ethernets with, 90
link/node failure, protection
against, 84
LLC (Logical Link Control)
Sublayer, explanation of, 5
LLIDs, role in ToS attacks in
EPONs, 189
Local Area Networks (LANs). See
LANs (Local Area Networks)
Logical Link Control (LLC)
Sublayer, explanation of, 5
loop aggregation, definition in IEEE
802.
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