2 Service Requirements from Carrier??™s Perspective
TDM: Circuit Bonding 297
Vendors Promoting This Solution
To provide a list vendors promoting a circuit-bonding solution, it will be necessary to
separate the list into three different categories:
?– N ?— STSs
?– N ?— DS3
?– N ?— T1s
The vendors included in this list represent only a sample of vendors providing circuitbonding
solutions.
Vendors Products
N ?« STSs
Lucent N ?— STSs, N ?— VT1.5
Alcatel N ?— STSs, N ?— VT1.5
Fujitsu N ?— STSs, N ?— VT1.5
Cisco N ?— STSs, N ?— VT1.5
Tellabs N ?— STSs, N ?— VT1.5
Ceterus Networks N ?— STSs, N ?— VT1.5
N ?« DS3
Ceterus Networks N ?— DS3s
N ?« T1s
Ceterus Networks N ?— T1s
Zhone N ?— T1s
ANDA N ?— T1s
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299
Chapter 11
SONET/MSPP
by Paul Havala
Since its standardization nearly 20 years ago, SONET technology has grown into the
predominant method of optical access for North American service providers. It is only
natural that these providers would want to use their tremendous installed base of
SONET equipment to deploy Ethernet services. This spurred the initial Ethernet over
SONET (EoS) implementations nearly 10 years ago.
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