SEARCH
0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Prev | Current Page 685 | Next

Abdul Kasim, Prasanna Adhikari, Nan Chen, and Norman Finn

"Delivering Carrier Ethernet: Extending Ethernet Beyond the LAN"

18 Using circuit bonding to link two corporate offices
Corporate main office Corporate branch office
Circuit-
bonding
equipment
Circuit-
bonding
equipment
Corporate
router LAN
Branch office switch
Ethernet service at customer premises
??? NxDS1, NxE1, NxDS3, NxOCn, STMn circuits
??? Transparent service end-to-end
Flexible services
??? User-defined priority for individual services
??? Ethernet services
??? PBX trunking
Access
network
Figure 10.19 Using circuit bonding to link corporate offices with a remote data center
Corporate site Remote data center
SAN array
Circuit-
bonding
equipment
Circuit-
bonding
equipment
NxDS1/NxE1
NxDS3
NxOCn/STMn
Local SAN array
??? Extend Ethernet ports to any location on TDM network
??? Circuit-grade QoS of TDM access network
??? Data storage, disaster recovery, data continuity
Access network
TDM: Circuit Bonding 293
Figure 10.20 Circuit bonding used to offer multi-services in a corporate network
H.Q./POP or
switch site
Remote site
Core
router
Circuit-
bonding
equipment
Circuit-
bonding
equipment
Customer voice
network
(VoIP or TDM)
Customer LAN
Voice
switch
Remote site
Customer voice
network
Customer LAN
Circuit-
bonding
equipment
??? Multi-service platform reduces cost to provide service
??? Router port extension: ???Virtual port??? at remote site
??? Bundled services over bonded T1: Ethernet, FR, ATM, VoIP
??? Circuit bonding helps scale service
Access network
Figure 10.


Pages:
673 674 675 676 677 678 679 680 681 682 683 684 685 686 687 688 689 690 691 692 693 694 695 696 697