Class 5
switch
WB
DCS Nx
T1 TDM
Ethernet
Voice: VoIP
or TDM
Frame
relay
MSPP/
ADM
MSPP
Data multiservice
switch/
cross connect
TDM:
Broadband
DCS
T1 terminal/
smarjack
Figure 10.16 Circuit-bonding modes
H.Q./POP or Switch Site
Core
Router
Circuit
Bonding
Hub
Circuit
Bonding
Equipment
Circuit
Bonding
Equipment
Circuit
Bonding
Equipment
Circuit
Bonding
Equipment
Customer Voice
Network
(VoIP or TDM)
Customer Voice
Network (VoIP or TDM)
Voice
Switch
Point to Multipoint
Point to Point
Access
Access
292 Chapter 10
Figure 10.17 Various circuit bonding architecture
Circuit-
bonding
equipment
Bonded
TDM circuits
T1
Frac T1
T1
Frac T1
Frame relay
VoIP
phone
Data center/SAN
LAN
Ethernet
TDM voice ??? Deliver Ethernet transport services over circuit-bonded
TDM circuits
??? Prioritize mission-critical applications over other services
??? Improve bandwidth utilization to > 90%
??? Deliver new services over existing network assets
??? Flexible: Grow bonded pipe with needs
??? Robust: Single circuit failure does not stop any single service
??? Resilient: Route services over a single virtual connection
WAN
Figure 10.
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