15 provides an overview of how circuit bonding fits into carrier networks.
Circuit-bonding equipment can also be deployed in several modes (see Figure 10.16):
?– Point-to-hub mode In this scenario, a circuit-bonding hub can be deployed in
the network core and can be used as a hubbing device for multiple CPE devices at
customer sites. These devices can be either circuit-bonding platforms, integrated
access devices, or native Ethernet devices.
?– Point-to-point mode Circuit bonding can also be deployed in the ???success-based???
mode for Ethernet private line (E-Line) services. In this case, circuit-binding equipment
can be deployed after the customer order is received, and it will be installed
on a point-to-point basis. In this way, no advance investment will be required, and
the system will only be installed after the circuit is sold.
Figures 10.17 to 10.21 illustrate various circuit-bonding architectures. It is also important
to note that with the exception of the circuit-bonding equipment, no other
complementary assets are needed to deliver Carrier Ethernet to customers.
TDM: Circuit Bonding 291
Figure 10.15 Circuit bonding in carrier networks
Network core
ILEC central office
Customer premises
L2/L3
switch/
router
Circuit-
bonding
hub
Circuit-
bonding
equipment
T1
frame
Frame
relay
IP core: MPLS,
IP VPN, etc.
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