Much like TDM/SONET-based services, carriers can offer SLAs on
Ethernet services to their customers and deliver carrier-grade Ethernet services without
building out a completely new overlay network.
Shortcomings
Circuit bonding is designed to provide Ethernet services to business customers where
high levels of reliability and QoS are desired or required. It requires the bonding of TDM
circuits to achieve the level of services required. When only best-effort traffic is sufficient
for the application, the cost of circuit bonding may be higher than other solutions,
such as copper bonding where only copper cables are required.
Secondly, the bandwidth of circuit bonding is still based on the hierarchy of the current
TDM- and SONET-based network. The granularity, while much better than the TDM
network, is still not as smooth and flexible as other solutions.
The other shortcoming of circuit bonding involves the additional overhead requirements
beyond the overhead associated with TDM/SONET. While the overhead requirement
for circuit bonding is relatively small, a portion will not be available for traffic
transportation.
Typical Deployment Scenarios
Figure 10.
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