8 Mbps 34.2 Mbps 76%
90 Mbps OC-3??“155 Mbps 2 ?— DS3 90 Mbps 65 Mbps 42%
450 Mbps OC-12??“622 Mbps 3 ?— OC3 465 Mbps 157 Mbps 25%
1 Gbps OC-48??“2500 Mbps 2 ?— OC12 1244 Mbps 1256 Mbps 50%
Ability to Grow
With the adaptation of the ITU standard on LCAS for virtual concatenated signals
(ITU standard G.7042/Y.1305), circuit bonding has the ability to dynamically and hitlessly
change (add and subtract) the capacity of a bonded transport pipe. This ability to
Figure 10.14 TDM bandwidth increments
DS1
1.544
Mbps
44.7/51.8
Mbps
155
Mbps
622
Mbps
DS3/
STS1
Traditional Metro Data Service Offerings
Metro Ethernet Service Offerings
STS-3
STS-12
STS
-48
1.544
Mbps
44.7/51.8
Mbps
155
Mbps
622
Mbps
1
Gbps
Inflexible scalability
in rigid TDM increments
Flexible scalability
in rigid TDM increments
1
Gbps
290 Chapter 10
add capacity seamlessly without a truck roll offers carriers the ability to sell additional
bandwidth without adding more hardware and operational costs.
Quality of Service and Protection
One of the main features of circuit bonding is its ability to offer hard QoS and multiple
levels of protection.
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