Emerging Ethernet services will be the same. Ethernet does not
offer new challenges that cannot be met utilizing the existing TDM network with a few
new functions incorporated at the edge of the network. Circuit bonding was developed
to perform these functions.
Benefits and Shortcomings
The benefits of circuit bonding are realized when bandwidth aggregation is coupled with
bandwidth sharing among multiplexed payloads and protection capabilities. Operating
in concert with existing transport systems, these functions extend the capabilities of
transport networks. Although there are several high-layer protocols with bonding features,
circuit bonding is most efficient as a simple, low-layer transport function allowing
any payload to be supported over any transport network.
The major benefits for deploying circuit bonding include
?– 100 percent Ethernet reach Carriers deploying circuit bonding can serve all
customer buildings with or without fiber access.
?– Highly efficient A higher bandwidth utilization percentage helps to improve
the profit margin and reduce leased bandwidth cost. Carriers can offer Ethernet
service in bandwidth increments that more closely match customer requirements,
therefore increasing customer acceptance of services provided.
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