Networked Solutions
Circuit-bonding-based products can be used to support networked data transport
applications as well as point-to-point services. As service providers deploy high volumes
of point-to-point systems, this creates a need for larger, more highly integrated devices
with additional functionality. These devices aggregate multiple circuit-bonded transport
links and incorporate a packet-based switch fabric instead of the TDM-based fabric
typically used today. The circuit-bonding platform thus supports flexible provisioning,
circuit switching, and network protection features that go beyond just handling pointto-
point links.
Future Applications for Circuit Bonding
Current applications using circuit-bonding technology are very much limited to the
access network. The process of aggregating the capacity of many channels together to
achieve a single big pipe has been defined in a generic manner. This allows for the level
of aggregation to change depending on the rates of the individual signals involved and
the desired rate of the big pipe. This flexibility will allow the big pipe architecture to
remain simple over time even as more and more capacity is created.
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