The flow control applies consistently to
an entire client signal.
Service Management Service management for circuit-bonding systems is well defined
by the ITU. A recently approved ITU standard on service management includes both
architecture and requirement definitions for circuit bonding optical- and copper-based
systems. While additional capabilities are being defined in the standards, it is safe to
say that service management for circuit bonding will provide full service management
capabilities for the carriers.
Backward Compatibility Circuit bonding can be used to carry TDM traffic as well as
Ethernet traffic, making it backward compatible with various types of client traffic. It
can be used to carry traditional voice as well as the modern VoIP traffic. Circuit bonding
can also be used to carry Frame Relay traffic in addition to the Ethernet traffic for
IP access.
Scalability Circuit bonding can be used to bond multiple TDM pipes together, forming
large pipes for Ethernet and TDM traffic. It can be scaled from bonding two T1s
together to bonding two OC12s for a full-rate GbE requirement.
Drivers for This Solution
In the following section, we will look at the drivers that led to the development of this
solution.
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