Circuit bonding can be used for any type of DS-3 facility. Figure 10.7 shows the use
of a circuit-bonding system with a variety of DS-3 facilities. These DS-3 facilities
may be transmuxed into SONET or transported over copper or radio.
Circuit bonding can also be adapted to copper facilities even if the Ethernet client
is using optical interfaces. Figure 10.8 shows the use of a circuit-bonding system
over several existing and planned copper-line interfaces, including DS-3 (existing),
DS-1, and E-1.
Figure 10.6 Ethernet over circuit bonding
Management plane
Transmit
Receive
Ethernet client
device
Ethernet client
device
10/100 10/100 10/100
GbE GbE GbE GbE
10/100
Ethernet client
device
Ethernet client
device
DS1
DS3
OC-N
DS1
DS3
OC-N
DS1
DS3
OC-N
DS1
DS3
OC-N
274 Chapter 10
?– Manageability Circuit bonding provides a complete transmission layer management
system. This allows carrier-grade fault isolation and performance monitoring
of a circuit bonded link, effectively extending carrier-class networking off-net to the
Ethernet customer.
Figure 10.9 shows circuit bonding being used to extend Ethernet to an off-net
customer.
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