In addition, the ability to multiplex
the client signals efficiently on ???just enough??? line-side transport allows these fractional
services to be offered at lower cost points, and the line service can grow as the
client base grows. The amount of bandwidth used can be adjusted dynamically
as Ethernet demand grows. For example, suppose additional Ethernet demand
requires the addition of a DS-3 line in a bonded circuit that is carried over a SONET
device. Because circuit bonding decouples the Ethernet layer from the SONET
layer, the available bandwidth is dynamically increased in a transparent manner
to the Ethernet layer. Simple SONET STS-1 transport is preserved with no need
for complex virtual concatenation.
?– Adaptability Circuit bonding can transport Ethernet frames over a variety of
line-side transport types. These include optical transport, such as OC-3, OC-12,
and OC-48, as well as DS-3 and DS-1. This allows the circuit bonding to be applied
in a wide array of off-net and on-net situations. Circuit bonding can extend the
usefulness of existing transport networks, eliminating the expense of deploying
next-generation SONET systems.
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