Technology Description
In today??™s access and metro networks, delivering broadband services to businesses is
both an attractive business opportunity and a technical challenge. Less than 20 percent
of all businesses are serviced directly by fiber, and the copper plant, in some instances,
TDM: Circuit Bonding 267
can be over fifty years old. Additionally, even recent copper installations are inherently
limited in bandwidth. Achieving true broadband speeds requires some means of
combining multiple pairs into a common bandwidth pool. Once established, this bandwidth
pool should be utilized in a way that maximizes the revenue potential for both
individual services or customers and services delivered to multi-tenant unit (MTU)
locations. Circuit bonding is a platform that addresses these network issues without
adversely impacting the existing network infrastructure, and it can be used with both
fiber and copper infrastructure.
Additionally, circuit bonding can support clients with higher rates than the individual
transport facilities. This capability is realized due to circuit bonding??™s ability to
create a large pool of bandwidth between locations by concatenating multiple parallel
transmission channels.
Pages:
625
626
627
628
629
630
631
632
633
634
635
636
637
638
639
640
641
642
643
644
645
646
647
648
649