PIC devices can drastically
reduce opto-electronic transponder costs??”which dominate carrier CAPEX??”and
help lower nodal losses. Indeed, this technology promises a true leap in capabilities by
reducing footprints, increasing reach, and enabling more elaborate optical-layer monitoring.
Recently, some PIC-based transport and OXC solutions have already come to
market and future evolutions are expected.
There is a lot of ongoing research in optical burst switching (OBS) and optical packet
switching (OPS) technologies [3]. These schemes introduce data-packet ???visibility??? at
the optical layer by processing packet header routing information (and optically bypassing
data segments). As such, OBS and OPS could conceivably support advanced
EVPL and EPLAN/EVPLAN services. However, both of these technologies face many
technical and ???prove-in??? hurdles, and despite many years of study, remain far from
real-world deployments [2].
Fiber and WDM 227
Ethernet Interface Evolutions
There is much ongoing debate in the data and optical networking communities about
the next Ethernet rate??”40 Gbps or 100 Gbps. (The TDM hierarchy already specifies
40 Gbps OC-768/STM-256 as the next increment.
Pages:
543
544
545
546
547
548
549
550
551
552
553
554
555
556
557
558
559
560
561
562
563
564
565
566
567